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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
10276673
Issue Dt:
04/30/2019
Application #:
15901235
Filing Dt:
02/21/2018
Publication #:
20190019871
Pub Dt:
01/17/2019
Inventors:
Myung Ho PARK, Ul Kyu SEO, Young Ho SEO, Jae Sik CHOI
Title:
SEMICONDUCTOR DIE HAVING STACKING STRUCTURE OF SILICON-METALLIC CONDUCTIVE LAYER-SILICON
Assignment: 1
Reel/Frame:
044989/0214Recorded: 02/21/2018Pages: 8
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
PARK, MYUNG HO
Exec Dt:
02/12/2018
SEO, UI KYU
Exec Dt:
02/12/2018
SEO, YOUNG HO
Exec Dt:
02/14/2018
CHOI, JAE SIK
Exec Dt:
02/12/2018
Assignee:
MAGNACHIP SEMICONDUCTOR, LTD.
215, DAESIN-RO, HEUNGDEOK-GU, CHUNGCHEONGBUK-DO
CHEONGJU-SI, KOREA, REPUBLIC OF 28429
Correspondent:
NSIP LAW
P.O. BOX 65745
WASHINGTON, DC 20035
Assignment: 2
Reel/Frame:
049127/0872Recorded: 05/09/2019Pages: 9
Conveyance:
CORRECTIVE ASSIGNMENT TO CORRECT THE 2ND INVENTOR'S NAME PREVIOUSLY RECORDED AT REEL: 044989 FRAME: 0214. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
Assignors:
PARK, MYUNG HO
Exec Dt:
02/12/2018
SEO, UL KYU
Exec Dt:
02/12/2018
SEO, YOUNG HO
Exec Dt:
02/14/2018
CHOI, JAE SIK
Exec Dt:
02/12/2018
Assignee:
MAGNACHIP SEMICONDUCTOR, LTD.
215, DAESIN-RO, HEUNGDEOK-GU, CHUNGCHEONGBUK-DO
CHEONGJU-SI, KOREA, REPUBLIC OF 28429
Correspondent:
NSIP LAW
P.O. BOX 65745
WASHINGTON, DC 20035

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