Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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12/03/2019
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Application #:
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16140522
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Filing Dt:
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09/24/2018
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Publication #:
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Pub Dt:
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01/24/2019
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Inventors:
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Linfang JIN, Guoping WANG, Hualin LI, Yongwang XIAO, Jie ZOU
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Title:
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HEAT DISSIPATION ASSEMBLY AND ELECTRONIC DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| B2-5 OF NANFANG FACTORY, NO.2 OF XINCHENG ROAD, SONGSHAN LAKE SCIENCE AND TECHNOLOGY INDUSTRIAL ZONE |
| DONGGUAN, CHINA 523808 |
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| KILPATRICK TOWNSEND & STOCKTON LLP (HUAW |
| 1100 PEACHTREE STREET |
| SUITE 2800 |
| ATLANTA, GA 30309 |
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Assignment:
2
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| B2-5 OF NANFANG FACTORY, NO.2 OF XINCHENG ROAD, |
| SONGSHAN LAKE SCIENCE AND TECHNOLOGY INDUSTRIAL ZONE, |
| DONGGUAN, CHINA 523808 |
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| HUAWEI TECHNOLOGIES CO., LTD. |
| BUILDING G1-2, HUAWEI INDUSTRIAL BASE, |
| BANTIAN,LONGGANG DISTRICT |
| SHENZHEN, 518129 CHINA |
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