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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
01/22/2019
Application #:
15652508
Filing Dt:
07/18/2017
Publication #:
Pub Dt:
01/24/2019
Inventors:
Wei-Chao Chiu, Kai Tzeng, Chih-Chien Wang, Chun-Wei Chang, Ching-Sen Kuo, Feng-Jia Shiu et al
Title:
Patterning for Substrate Fabrication
Assignment: 1
Reel/Frame:
043202/0484Recorded: 08/04/2017Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
07/26/2017
Exec Dt:
07/26/2017
Exec Dt:
07/26/2017
Exec Dt:
07/26/2017
Exec Dt:
07/26/2017
Exec Dt:
07/26/2017
Exec Dt:
07/26/2017
Assignee:
8, LI-HSIN RD. 6
HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 300-78
Correspondent:
HAYNES AND BOONE, LLP IP SECTION
2323 VICTORY AVENUE
SUITE 700
DALLAS, TX 75219

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