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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
06/23/2020
Application #:
16068811
Filing Dt:
07/09/2018
Publication #:
Pub Dt:
02/07/2019
Inventors:
Akinobu HORITA, Kenji SHIMADA, Kenichi TAKAHASHI, Aya ITO, Toshiyuki OIE
Title:
WET ETCHING COMPOSITION FOR SUBSTRATE HAVING SiN LAYER AND Si LAYER AND WET ETCHING METHOD USING SAME
Assignment: 1
Reel/Frame:
046295/0778Recorded: 07/09/2018Pages: 7
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
01/19/2018
Exec Dt:
01/18/2018
Exec Dt:
01/18/2018
Exec Dt:
01/19/2018
Exec Dt:
01/19/2018
Assignee:
5-2, MARUNOUCHI 2-CHOME, CHIYODA-KU
TOKYO, JAPAN 100-8324
Correspondent:
OBLON, ET AL.
1940 DUKE STREET
ALEXANDRIA, VA 22314

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