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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
10/01/2019
Application #:
16042013
Filing Dt:
07/23/2018
Publication #:
Pub Dt:
02/07/2019
Inventor:
Silversun Sturgis
Title:
Highly RFI Shielded Modular Electronics Packaging System
Assignment: 1
Reel/Frame:
046918/0772Recorded: 08/23/2018Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
08/17/2018
Assignee:
1400 16TH STREET, NW
SUITE 730
WASHINGTON, DISTRICT OF COLUMBIA 20036
Correspondent:
REMENICK PLLC
1025 THOMAS JEFFERSON ST NW
SUITE 175
WASHINGTON, DC 200075201

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