Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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15673478
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Filing Dt:
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08/10/2017
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Publication #:
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Pub Dt:
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02/14/2019
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Inventors:
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Peng Suo, Yu Gu, Guan Huei See, Arvind Sundarajan
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Title:
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METHOD OF INCREASING EMBEDDED 3D METAL-INSULATOR-METAL (MIM) CAPACITOR CAPACITANCE DENSITY FOR WAFER LEVEL PACKAGING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8 UPPER CHANGI ROAD NORTH |
| APPLIED MATERIALS BUILDING |
| SINGAPORE, SINGAPORE 506906 |
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| MOSER TABOADA/ALAN TABOADA |
| 1030 BROAD STREET |
| SUITE 203 |
| SHREWSBURY, NJ 07702 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3050 BOWERS AVENUE |
| SANTA CLARA, CALIFORNIA 95054 |
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| MOSER TABOADA/ALAN TABOADA |
| 1030 BROAD STREET |
| SUITE 203 |
| SHREWSBURY, NJ 07702 |
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