Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/28/2020
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Application #:
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15719515
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Filing Dt:
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09/28/2017
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Publication #:
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Pub Dt:
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03/07/2019
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Inventors:
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Li-Chieh Hsu, Fu-Shou Tsai, Kun-Ju Li, Po-Cheng Huang, Chun-Liang Liu
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Title:
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WAFER POLISHING PAD AND USING METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.3, LI-HSIN ROAD 2, SCIENCE-BASED INDUSTRIAL PARK |
| HSIN-CHU CITY, TAIWAN |
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| WINSTON HSU |
| 5F., NO.389, FUHE RD., YONGHE DIST., |
| NEW TAIPEI CITY, TAIWAN |
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