Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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16085061
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Filing Dt:
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09/14/2018
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Publication #:
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Pub Dt:
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03/14/2019
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Inventors:
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Kentaro SHINDO, Hisashi KITAGAKI, Tadayuki HANADA, Kenji SUZUKI, Syuntaro TERAUCHI et al
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Title:
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TiAI-BASED INTERMETALLIC SINTERED COMPACT AND METHOD FOR PRODUCING TiAI-BASED INTERMETALLIC SINTERED COMPACT
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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1200, HIGASHI-TANAKA, KOMAKI-SHI |
AICHI, JAPAN 485-0826 |
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4-4-28, ZUIKOU, HIGASHIYODOGAWA-KU, OSAKA-SHI |
OSAKA, JAPAN 533-0005 |
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BENJAMIN J. HAUPTMAN |
2318 MILL ROAD |
ALEXANDRIA, VA 22314 |
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