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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
10446476
Issue Dt:
10/15/2019
Application #:
15925022
Filing Dt:
03/19/2018
Publication #:
20190088576
Pub Dt:
03/21/2019
Inventors:
LEO M. HIGGINS III, Yadong Wei, Fred T. Brauchler, Burton Jesse Carpenter, Jinmei Liu et al
Title:
PACKAGED INTEGRATED CIRCUIT HAVING STACKED DIE AND METHOD FOR THEREFOR
Assignment: 1
Reel/Frame:
045275/0954Recorded: 03/19/2018Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
HIGGINS, LEO M., III
Exec Dt:
09/27/2017
BRAUCHLER, FRED T.
Exec Dt:
09/27/2017
CARPENTER, BURTON JESSE
Exec Dt:
10/03/2017
LIU, JINMEI
Exec Dt:
09/28/2017
CHING, MARIANO LAYSON, JR.
Exec Dt:
09/28/2017
YAO, JINZHONG
Exec Dt:
09/28/2017
PANG, XINGSHOU
Exec Dt:
09/28/2017
WANG, JIANHONG
Exec Dt:
09/28/2017
WEI, YADONG
Exec Dt:
09/28/2017
Assignee:
NXP USA, INC.
6501 WILLIAM CANNON DRIVE WEST
OE:62
AUSTIN, TEXAS 78735
Correspondent:
NXP USA, INC. LAW DEPARTMENT
6501 WILLIAM CANNON DRIVE WEST TX30/OE62
AUSTIN, TX 78735

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