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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
08/06/2019
Application #:
15813596
Filing Dt:
11/15/2017
Publication #:
Pub Dt:
03/28/2019
Inventors:
Chang-Hwang HUA, Shu Chen CHEN, Walter Tony WOHLMUTH, Huang-Wen WANG
Title:
COMPOUND SEMICONDUCTORS HAVING AN IMPROVED HIGH TEMPERATURE RESISTANT BACKSIDE METALIZATION
Assignment: 1
Reel/Frame:
044149/0770Recorded: 11/16/2017Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
10/16/2017
Exec Dt:
10/16/2017
Exec Dt:
10/16/2017
Exec Dt:
10/17/2017
Assignee:
NO. 69, TECHNOLOGY 7TH RD., HWAYA TECHNOLOGY PARK, GUISHAN DISTRICT
TAO YUAN CITY, TAIWAN
Correspondent:
MUNCY, GEISSLER, OLDS & LOWE, PC
4000 LEGATO RD., SUITE 310
FAIRFAX, VA 22033

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