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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
09/22/2020
Application #:
16144169
Filing Dt:
09/27/2018
Publication #:
Pub Dt:
03/28/2019
Inventors:
Ingo Muri, Bernhard Goller
Title:
Semiconductor Chip Including Self-Aligned, Back-Side Conductive Layer and Method for Making the Same
Assignment: 1
Reel/Frame:
047273/0881Recorded: 10/23/2018Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
09/28/2018
Exec Dt:
09/28/2018
Assignee:
AM CAMPEON 1-15
NEUBIBERG, GERMANY 85579
Correspondent:
MURPHY, BILAK & HOMILLER/INFINEON TECHNO
1255 CRESCENT GREEN
SUITE 200
CARY, NC 27518

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