Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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05/26/2020
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Application #:
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16133216
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Filing Dt:
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09/17/2018
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Publication #:
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Pub Dt:
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03/28/2019
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Inventor:
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Chee Hak Teh
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Title:
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MODULAR INTERCONNECTION REPAIR OF MULTI-DIE PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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2200 MISSION COLLEGE BOULEVARD |
SANTA CLARA, CALIFORNIA 95054 |
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INTEL CORPORATION C/O FLETCHER YODER PC |
P.O. BOX 692289 |
HOUSTON, TX 77044 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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BLANCHARDSTOWN CORPORATE PARK 2 |
PLAZA 255, SUITE 2A |
DUBLIN, IRELAND D15 YH6H |
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TAHOE RESEARCH, LTD. |
BLANCHARDSTOWN CORPORATE PARK 2 |
PLAZA 255, SUITE 2A |
DUBLIN, D15 YH6H IRELAND |
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