Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
Total Assignments:
1
|
Patent #:
|
|
Issue Dt:
|
12/03/2019
|
Application #:
|
15718837
|
Filing Dt:
|
09/28/2017
|
Publication #:
|
|
Pub Dt:
|
03/28/2019
| | | | |
Inventors:
|
HSIEN-JU TSOU, CHIH-WEI WU, YING-CHING SHIH, JING-CHENG LIN, PU WANG, SZU-WEI LU
|
Title:
|
SEMICONDUCTOR PACKAGE, METHOD FOR FORMING SEMICONDUCTOR PACKAGE, AND METHOD FOR FORMING SEMICONDUCTOR ASSEMBLY
|
|
Assignment:
1
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
HSINCHU, TAIWAN |
|
|
|
WPAT, PC INTELLECTUAL PROPERTY ATTORNEYS |
2301 DUPONT DR. SUITE 510 |
IRVINE, CA 92612 |
|
|
Search Results as of:
05/12/2024 05:57 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|