Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/30/2019
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Application #:
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15717976
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Filing Dt:
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09/28/2017
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Publication #:
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Pub Dt:
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03/28/2019
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Inventors:
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Min-Chien Hsiao, Chen-Hua Yu, Chung-Shi Liu, Chao-Wen Shih, Shou-Zen Chang
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Title:
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PACKAGE STRUCTURE, ELECTRONIC DEVICE AND METHOD OF FABRICATING PACKAGE STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, |
| HSINCHU, TAIWAN 30078 |
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| JCIPRNET |
| P.O. BOX, TAIPEI GUTING |
| TAIPEI, 600 TAIWAN |
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