Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/11/2020
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Application #:
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16086982
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Filing Dt:
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09/20/2018
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Publication #:
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Pub Dt:
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04/04/2019
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Inventors:
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Hiroki MYODO, Toyokazu HOTCHI
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Title:
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RESIN COMPOSITION AND SEMICONDUCTOR DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3993, NIGORIKAWA, KITA-KU, NIIGATA-SHI |
| NIIGATA, JAPAN 950-3131 |
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| RANKIN, HILL & CLARK LLP |
| 23755 LORAIN ROAD, SUITE 200 |
| NORTH OLMSTED, OH 44070 |
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