Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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15744863
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Filing Dt:
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01/15/2018
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Publication #:
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Pub Dt:
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04/04/2019
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Inventors:
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Chong WANG, Jia PENG, Wei HE, Jiao CHENG, Dingjun XIAO
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Title:
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Copper Electroplating Solution and Copper Electroplating Process
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 295 DAXUE ROAD, JINPING DISTRICT |
| SHANTOU, CHINA 515061 |
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| BUILDING 101, NO. 182, KENGBIAN ROAD, CHENDONG VILLAGE, ZHONGLUOTAN TOWN, BAIYUN DISTRICT |
| GUANGZHOU, CHINA 510550 |
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| KILPATRICK TOWNSEND & STOCKTON LLP MAILS |
| 1100 PEACHTREE STREET |
| SUITE 2800 |
| ATLANTA, GA 30309 |
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