Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/04/2020
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Application #:
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16148316
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Filing Dt:
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10/01/2018
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Publication #:
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Pub Dt:
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04/04/2019
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Inventors:
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Irmgard Escher-Poeppel, Johannes Lodermeyer, Thorsten Meyer, Ivan Nikitin, Edmund Riedl et al
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Title:
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Metallic Interconnect, a Method of Manufacturing a Metallic Interconnect, a Semiconductor Arrangement and a Method of Manufacturing a Semiconductor Arrangement
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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AM CAMPEON 1-15 |
NEUBIBERG, GERMANY 85579 |
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MURPHY, BILAK & HOMILLER/INFINEON TECHNO |
1255 CRESCENT GREEN |
SUITE 200 |
CARY, NC 27518 |
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05/13/2024 03:06 AM
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