Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/26/2021
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Application #:
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16080163
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Filing Dt:
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08/27/2018
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Publication #:
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Pub Dt:
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04/18/2019
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Inventors:
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Daisuke Oya, Tatsuya Iwasa, Yuki Wakabayashi, Keisuke Tanaka, Mikio Ishihara, Koji Saito
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Title:
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SEMICONDUCTOR-MOUNTING HEAT DISSIPATION BASE PLATE AND PRODUCTION METHOD THEREFOR
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 7-3, MARUNOUCHI 2-CHOME |
| CHIYODA-KU |
| TOKYO, JAPAN 100-8310 |
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| BUCHANAN, INGERSOLL & ROONEY PC |
| POST OFFICE BOX 1404 |
| ALEXANDRIA, VA 22313-1404 |
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