Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/24/2020
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Application #:
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16052117
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Filing Dt:
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08/01/2018
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Publication #:
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Pub Dt:
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04/25/2019
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Inventors:
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Ji-Han Ko, Bo Ram Kang, Dong Kwan Kim
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Title:
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PRINTED CIRCUIT BOARDS WITH ANTI-WARPING MOLDING PORTIONS AND RELATED SEMICONDUCTOR PACKAGES AND METHODS OF FABRICATING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 129, SAMSUNG-RO, YEONGTONG-GU |
| SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 16677 |
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| WARD AND SMITH, P.A. |
| 751 CORPORATE CENTER DRIVE |
| SUITE 300 |
| RALEIGH, NC 27607 |
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