Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
06/01/2021
|
Application #:
|
16173007
|
Filing Dt:
|
10/29/2018
|
|
Publication #:
|
|
Pub Dt:
|
05/02/2019
| | | | |
|
Inventors:
|
CHIEN-SHOU LIAO, CHIH-WEI YU
|
|
Title:
|
CUTTING DEVICE FOR THIN SEMICONDUCTOR WAFER AND CUTTING METHOD THEREOF
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 2F.-1, NO.13, LN. 249, LINSEN RD., YUANLIN TOWNSHIP |
| CHANGHUA COUNTY, TAIWAN 51044 |
|
|
|
|
| LI&CAI INTELLECTUAL PROPERTY(USA) OFFICE |
| 3057 NUTLEY STREET |
| SUITE 818 |
| FAIRFAX, VA 22031 |
|
|
Search Results as of:
05/23/2024 10:28 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
