Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/20/2021
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Application #:
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16095499
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Filing Dt:
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10/22/2018
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Publication #:
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Pub Dt:
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05/02/2019
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Inventors:
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Stefan Reber, Kai Schillinger, Frank Siebke
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Title:
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SILICON WAFER FOR AN ELECTRONIC COMPONENT AND METHOD FOR THE PRODUCTION THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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HANS-BUNTE-STRASSE 19 |
FREIBURG, GERMANY 79108 |
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RANDOLPH J. HUIS |
30 SOUTH 17TH STREET |
PHILADELPHIA, PA 19103 |
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06/18/2024 01:23 AM
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