Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/01/2020
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Application #:
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15795276
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Filing Dt:
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10/27/2017
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Publication #:
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Pub Dt:
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05/02/2019
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Inventors:
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Feng-Cheng Hsu, Hsien-Wen Liu, Hsiao-Wen Lee, Han-Hsiang Huang, Shin-Puu Jeng et al
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Title:
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MULTI-CHIP WAFER LEVEL PACKAGES AND METHODS OF FORMING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, |
| HSINCHU, TAIWAN 300-78 |
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| JCIPRNET |
| P.O. BOX 600 TAIPEI GUTING |
| TAIPEI CITY, 10099 TAIWAN |
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