Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/15/2022
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Application #:
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15939310
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Filing Dt:
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03/29/2018
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Publication #:
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Pub Dt:
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05/02/2019
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Inventors:
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Ching-Jung Yang, Hsien-Wei Chen
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Title:
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DIE STACK STRUCTURE WITH HYBRID BONDING STRUCTURE AND METHOD OF FABRICATING THE SAME AND PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, |
| HSINCHU, TAIWAN 300-78 |
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| JCIPRNET |
| P.O. BOX 600 TAIPEI GUTING |
| TAIPEI CITY, 10099 TAIWAN |
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