Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/24/2019
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Application #:
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15874541
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Filing Dt:
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01/18/2018
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Publication #:
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Pub Dt:
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05/02/2019
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Inventors:
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Shin-Puu JENG, Po-Hao TSAI, Po-Yao CHUANG, Feng-Cheng HSU, Shuo-Mao CHEN, Techi WONG
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Title:
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METHOD FOR FORMING CHIP PACKAGE WITH RECESSED INTERPOSER SUBSTRATE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
HSINCHU, TAIWAN 300-78 |
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BIRCH, STEWART, KOLASCH & BIRCH, LLP |
8110 GATEHOUSE ROAD, SUITE 100E |
FALLS CHURCH, VA 22042 |
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