Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/06/2020
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Application #:
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16306708
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Filing Dt:
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12/03/2018
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Publication #:
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Pub Dt:
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05/02/2019
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Inventors:
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Nobuyuki Terasaki, Toyo Ohashi
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Title:
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METHOD FOR MANUFACTURING INSULATED CIRCUIT BOARD, INSULATED CIRCUIT BOARD, AND THERMOELECTRIC CONVERSION MODULE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3-2, OTEMACHI 1-CHOME, CHIYODA-KU |
| TOKYO, JAPAN 100-8117 |
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| LOCKE LORD LLP |
| P.O. BOX 55874 |
| BOSTON, MA 02205 |
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