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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
16234852
Filing Dt:
12/28/2018
Publication #:
Pub Dt:
05/09/2019
Inventors:
Akihiro Horibe, Yasuteru Kohda, Seiji Munetoh, Chitra Subramanian, Kuniaki Sueoka
Title:
WAFER SCALE TESTING AND INITIALIZATION OF SMALL DIE CHIPS
Assignment: 1
Reel/Frame:
047866/0200Recorded: 12/28/2018Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
09/19/2017
Exec Dt:
09/19/2017
Exec Dt:
09/19/2017
Exec Dt:
09/19/2017
Exec Dt:
09/19/2017
Assignee:
NEW ORCHARD ROAD
ARMONK, NEW YORK 10504
Correspondent:
TUTUNJIAN & BITETTO, P.C.
401 BROADHOLLOW ROAD
SUITE 402
MELVILLE, NY 11747
Assignment: 2
Reel/Frame:
054476/0046Recorded: 11/26/2020Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
09/29/2020
Assignee:
1891 ROBERTSON ROAD
SUITE 100
OTTAWA, CANADA K2H 5B7
Correspondent:
ELPIS TECHNOLOGIES INC.
1891 ROBERTSON ROAD
SUITE 100
OTTAWA, K2H 5B7 CANADA

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