Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/02/2021
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Application #:
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16181383
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Filing Dt:
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11/06/2018
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Publication #:
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Pub Dt:
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05/09/2019
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Inventor:
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Masanori Shindo
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Title:
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SEMICONDUCTOR DEVICE BONDING AREA INCLUDING FUSED SOLDER FILM AND MANUFACTURING METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2-4-8 SHINYOKOHAMA, KOUHOKU-KU |
| YOKOHAMA, JAPAN 222-8575 |
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| VOLENTINE, WHITT & FRANCOS, PLLC |
| 11951 FREEDOM DRIVE, 13TH FLOOR |
| RESTON, VA 20190 |
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