Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/09/2021
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Application #:
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16171950
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Filing Dt:
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10/26/2018
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Publication #:
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Pub Dt:
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05/16/2019
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Inventors:
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Yao-Wen HSU, Ching-Hung KAO, Po-Jen WANG, Tsung-Han TSAI
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Title:
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SEMICONDUCTOR WAFER WITH MODIFIED SURFACE AND FABRICATION METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.8, LI-HSIN RD.6 |
| SCIENCE-BASED INDUSTRIAL PARK |
| HSINCHU, TAIWAN 300 |
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| R. BURNS ISRAELSEN |
| MASCHOFF BRENNAN |
| 1389 CENTER DR. SUITE 300 |
| PARK CITY, UT 84098 |
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