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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
16184022
Filing Dt:
11/08/2018
Publication #:
20190148132
Pub Dt:
05/16/2019
Inventors:
Hideji HORITA, Norihisa ARIFUKU, Akihito KAWAI, Sakae MATSUZAKI, Noriko ITO, Setsusei REI et al
Title:
METHOD OF MANUFACTURING SMALL-DIAMETER WAFER
Assignment: 1
Reel/Frame:
047451/0247Recorded: 11/08/2018Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
HORITA, HIDEJI
Exec Dt:
10/17/2018
MATSUZAKI, SAKAE
Exec Dt:
10/22/2018
ITO, NORIKO
Exec Dt:
10/16/2018
ARIFUKU, NORIHISA
Exec Dt:
10/17/2018
REI, SETSUSEI
Exec Dt:
10/17/2018
KAWAI, AKIHITO
Exec Dt:
10/17/2018
OGASAWARA, MAI
Exec Dt:
10/17/2018
Assignee:
DISCO CORPORATION
13-11, OMORI-KITA 2-CHOME, OTA-KU,
TOKYO, JAPAN 143-8580
Correspondent:
GREER BURNS & CRAIN LTD
300 S. WACKER DR.
SUITE 2500
CHICAGO, 60606 UNITED STATES

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