Patent Assignment Abstract of Title
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Total Assignments:
5
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Patent #:
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Issue Dt:
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05/04/2021
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Application #:
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16243995
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Filing Dt:
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01/09/2019
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Publication #:
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Pub Dt:
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05/16/2019
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Inventors:
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Fumitomo Watanabe, Mitsuhisa Watanabe, Masanori Yoshida
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Title:
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SEMICONDUCTOR DEVICE ASSEMBLIES WITH MOLDED SUPPORT SUBSTRATES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8000 S. FEDERAL WAY |
| P.O. BOX 6 |
| BOISE, IDAHO 83707-0006 |
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| PERKINS COIE LLP |
| P.O. BOX 1247 |
| PATENT PROCUREMENT |
| SEATTLE, WA 98111-1247 |
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Assignment:
2
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SUPPLEMENT NO. 12 TO PATENT SECURITY AGREEMENT
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| 1300 THAMES STREET |
| 4TH FLOOR |
| BALTIMORE, MARYLAND 21231 |
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| MARCELA ROBLEDO |
| 2475 HANOVER STREET |
| PALO ALTO, CA 94304 |
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Assignment:
3
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SUPPLEMENT NO. 3 TO PATENT SECURITY AGREEMENT
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| 10 S. DEARBORN |
| 7TH FLOOR |
| CHICAGO, ILLINOIS 60603 |
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| MARCELA ROBLEDO |
| 2475 HANOVER STREET |
| PALO ALTO, CA 94304 |
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Assignment:
4
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RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS).
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| 8000 S FEDERAL WAY |
| BOISE, IDAHO 83707 |
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| WSGR, C/O QUI LU FLOOD, SENIOR PARALEGAL |
| ONE MARKET, SPEAR TOWER, SUITE 3300 |
| SAN FRANCISCO, CA 94105 |
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Assignment:
5
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RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS).
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| 8000 S FEDERAL WAY |
| BOISE, IDAHO 83707 |
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| WSGR, C/O QUI LU FLOOD, SENIOR PARALEGAL |
| ONE MARKET, SPEAR TOWER, SUITE 3300 |
| SAN FRANCISCO, CA 94105 |
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