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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
10727117
Issue Dt:
07/28/2020
Application #:
16130690
Filing Dt:
09/13/2018
Publication #:
20190157141
Pub Dt:
05/23/2019
Inventors:
YU-HSIANG LIAO, LI-WEI CHU, HUNG-YI HUANG, CHING-HWANQ SU, YA-HUEI LI, CHUN-WEN NIEH et al
Title:
METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE
Assignment: 1
Reel/Frame:
052565/0093Recorded: 05/04/2020Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
LIAO, YU-HSIANG
Exec Dt:
04/08/2020
LI, YA-HUEI
Exec Dt:
04/08/2020
CHU, LI-WEI
Exec Dt:
04/07/2020
NIEH, CHUN-WEN
Exec Dt:
04/07/2020
HUANG, HUNG-YI
Exec Dt:
04/08/2020
CHANG, CHIH-WEI
Exec Dt:
04/07/2020
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK
HSINCHU, TAIWAN
Correspondent:
WPAT, PC INTELLECTUAL PROPERTY ATTORNEYS
1100 QUAIL STREET, SUITE 202
NEWPORT BEACH, CA 92660

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