Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/31/2019
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Application #:
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16153251
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Filing Dt:
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10/05/2018
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Publication #:
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Pub Dt:
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05/23/2019
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Inventors:
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Takahiro MORIKAWA, Kan YASUI, Masakazu SAGAWA, Motoyuki MIYATA, Toshiaki MORITA
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Title:
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SEMICONDUCTOR CHIP AND POWER MODULE, AND MANUFACTURING METHOD OF THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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2-2, OMIKA-CHO 5-CHOME |
HITACHI-SHI, IBARAKI, JAPAN 319-1221 |
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ERIC G. KING |
MILES & STOCKBRIDGE PC |
1751 PINNACLE DRIVE SUITE 1500 |
TYSONS CORNER, VA 22102-3833 |
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05/02/2024 01:36 AM
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