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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
11/24/2020
Application #:
16112122
Filing Dt:
08/24/2018
Publication #:
Pub Dt:
05/30/2019
Inventors:
Yasutoshi Okuno, Pang-Yen Tsai, Mrunal A Khaderbad, Sung-Li Wang, Shen-Nan Lee et al
Title:
Method of Forming Contact Plugs for Semiconductor Device
Assignment: 1
Reel/Frame:
046708/0010Recorded: 08/27/2018Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
08/20/2018
Exec Dt:
08/07/2018
Exec Dt:
08/07/2018
Exec Dt:
08/07/2018
Exec Dt:
08/07/2018
Exec Dt:
08/20/2018
Assignee:
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 300-78
Correspondent:
SLATER MATSIL, LLP
17950 PRESTON RD., SUITE 1000
DALLAS, TX 75252

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