Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/24/2020
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Application #:
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16098231
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Filing Dt:
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11/01/2018
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Publication #:
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Pub Dt:
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05/30/2019
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Inventors:
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Hideki YOSHINO, Masaaki MIURA
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Title:
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BONDING METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3-1-5, SAKAE-CHO, HAMURA-SHI |
| TOKYO, JAPAN 205-8607 |
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| WENDEROTH, LIND & PONACK, L.L.P. |
| 1030 15TH STREET NW |
| SUITE 400 EAST |
| WASHINGTON, DC 20005 |
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