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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
09/07/2021
Application #:
15909800
Filing Dt:
03/01/2018
Publication #:
Pub Dt:
05/30/2019
Inventors:
Ryan Chia-Jen CHEN, Yi-Chun CHEN, Li-Wei YIN, Cheng-Chung CHANG, Ming-Ching CHANG et al
Title:
Semiconductor Structure Cutting Process and Structures Formed Thereby
Assignment: 1
Reel/Frame:
045547/0348Recorded: 04/16/2018Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
02/26/2018
Exec Dt:
02/26/2018
Exec Dt:
02/26/2018
Exec Dt:
02/26/2018
Exec Dt:
02/26/2018
Exec Dt:
02/26/2018
Exec Dt:
02/26/2018
Exec Dt:
02/26/2018
Assignee:
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK
HSINCHU, TAIWAN
Correspondent:
PATTERSON & SHERIDAN, LLP
24 GREENWAY PLAZA
SUITE 1600
HOUSTON, TX 77046

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