Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/22/2019
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Application #:
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16249169
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Filing Dt:
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01/16/2019
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Publication #:
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Pub Dt:
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05/30/2019
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Inventor:
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Ku Yong KIM
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Title:
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PCB Module Having Multi-Sided Heat Sink Structure And Multilayer PCB Assembly For Use In Same
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| (HORIM-DONG) #1-409, DAEGU MACHATRONICS&MATERIALS |
| INSTITUTE,32, SEONGSEOGONGDAN-RO 11-GIL, DALSEO-GU |
| DAEGU, KOREA, REPUBLIC OF 42714 |
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| HARNESS DICKEY (ST. LOUIS) |
| 7700 BONHOMME, SUITE 400 |
| ST. LOUIS, MO 63105 |
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