Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/22/2020
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Application #:
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16211421
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Filing Dt:
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12/06/2018
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Publication #:
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Pub Dt:
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06/06/2019
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Inventors:
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Do Hyung KIM, Sang Hoon AN
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Title:
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METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE USING SIDE MOLDING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 138, CHEONGBUKSANDAN-RO, CHEONGBUK-MYEON, PYEONGTAEK-SI |
| GYEONGGI-DO, KOREA, REPUBLIC OF 17792 |
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| MAYER & WILLIAMS PC |
| 55 MADISON AVENUE |
| MORRISTOWN, NJ 07960 |
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