Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/23/2022
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Application #:
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16306670
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Filing Dt:
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12/03/2018
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Publication #:
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Pub Dt:
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06/13/2019
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Inventors:
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Soichi OTA, Makoto KATO, Hitoshi MAFUNE, Masayuki OSADA
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Title:
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THERMOSETTING CONDUCTIVE ADHESIVE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 4-3-3 MINAMIOSAWA, HACHIOJI-SHI |
| TOKYO, JAPAN 1920398 |
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| MAIER & MAIER, PLLC |
| 345 SOUTH PATRICK STREET |
| ALEXANDRIA, VA 22314 |
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