Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/16/2019
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Application #:
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15945308
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Filing Dt:
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04/04/2018
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Publication #:
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Pub Dt:
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06/13/2019
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Inventors:
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Chih-Jen Yang, Po-Hao Wang, Yu-Chih Cheng, Chang-Fu Lin, Chee-Key Chung
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Title:
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ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 123, SEC. 3, DAFENG RD., TANTZI DIST. |
| TAICHUNG CITY, TAIWAN 427 |
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| MINTZ LEVIN |
| ONE FINANCIAL CENTER |
| BOSTON, MA 02111 |
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