Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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15835580
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Filing Dt:
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12/08/2017
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Publication #:
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Pub Dt:
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06/13/2019
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Inventors:
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Jesus Mennen Belonio JR., Shou Cheng Eric Hu
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Title:
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Wafer Level Molded PPGA (Pad Post Grid Array) for Low Cost Package
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| TOWER BRIDGE HOUSE |
| ST. KATHARINE'S WAY |
| LONDON, UNITED KINGDOM E1W 1AA |
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| SAILE ACKERMAN LLC |
| 28 DAVIS AVENUE |
| POUGHKEEPSIE, NY 12603 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| HET ZUIDERKRUIS 53 |
| 'S-HERTOGENBOSCH, NETHERLANDS 5215 MV |
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| SAILE ACKERMAN LLC |
| 28 DAVIS AVENUE |
| POUGHKEEPSIE, NY 12603 |
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