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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
12/07/2021
Application #:
16311780
Filing Dt:
12/20/2018
Publication #:
Pub Dt:
07/04/2019
Inventor:
Robin Adam Simpson
Title:
Semiconductor Device Sub-Assembly
Assignment: 1
Reel/Frame:
047827/0988Recorded: 12/20/2018Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
12/19/2018
Assignees:
DODDINGTON ROAD, LINCOLN
LINCOLNSHIRE, UNITED KINGDOM LN6 3LF
SHIDAI ROAD, SHIFENG DISTRICT, ZHUZHOU
HUNAN, UNITED KINGDOM 412001
Correspondent:
TAROLLI, SUNDHEIM, COVELL & TUMMINO L.L.
1300 EAST NINTH STREET, SUITE 1700
CLEVELAND, OH 44114

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