Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/06/2020
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Application #:
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16330087
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Filing Dt:
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03/03/2019
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Publication #:
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Pub Dt:
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07/11/2019
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Inventor:
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Hong Lin
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Title:
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METHOD FOR HYBRID WAFER-TO-WAFER BONDING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.497, GAOSI ROAD, ZHANGJIANG HIGH-TECH PARK, PUDONG |
| SHANGHAI, CHINA 201210 |
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| TIANCHEN LLC. |
| 3302 TOWER1, NO.388 ZHONGJIANG ROAD, PUT |
| SHANGHAI, 200062 CHINA |
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