Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/16/2019
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Application #:
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15867577
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Filing Dt:
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01/10/2018
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Publication #:
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Pub Dt:
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07/11/2019
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Inventors:
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Hung-Hsin Hsu, Chi-An Wang, Ming-Chih Chen, Hsien-Wen Hsu, Yuan-Fu Lan
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Title:
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STACKED PACKAGE INCLUDING EXTERIOR CONDUCTIVE ELEMENT AND A MANUFACTURING METHOD OF THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO.10, DATONG RD. |
HUKOU TOWNSHIP, HSINCHU COUNTY, TAIWAN 30352 |
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PATENTTM.US |
P. O. BOX 82788 |
PORTLAND, OR 97282-0788 |
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