Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/03/2022
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Application #:
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16249172
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Filing Dt:
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01/16/2019
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Publication #:
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Pub Dt:
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07/18/2019
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Inventors:
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Olaf Hohlfeld, Gottfried Beer, Georg Meyer-Berg, Juergen Hoegerl, Magdalena Hoier
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Title:
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Power Semiconductor Module Having a Direct Copper Bonded Substrate and an Integrated Passive Component, and an Integrated Power Module
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| AM CAMPEON 1-12 |
| NEUBIBERG, GERMANY 85579 |
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| MURPHY, BILAK & HOMILLER/INFINEON TECHNO |
| 1255 CRESCENT GREEN |
| SUITE 200 |
| CARY, NC 27518 |
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05/09/2024 04:50 PM
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