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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
03/14/2023
Application #:
16374649
Filing Dt:
04/03/2019
Publication #:
Pub Dt:
07/25/2019
Inventors:
Takuya ISHIDA, Yoshifumi MAKI, Shinya HIRAI
Title:
METHOD OF MANUFACTURING ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT
Assignment: 1
Reel/Frame:
048787/0286Recorded: 04/03/2019Pages: 8
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
02/21/2019
Exec Dt:
03/04/2019
Exec Dt:
02/22/2019
Assignee:
10-1, HIGASHIKOTARI 1-CHOME, NAGAOKAKYO-SHI
KYOTO-FU, JAPAN 617-8555
Correspondent:
STUDEBAKER & BRACKETT PC
8255 GREENSBORO DRIVE
SUITE 300
TYSONS, VA 22102

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