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Patent Assignment Abstract of Title

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Total Assignments: 2

Patent #:	NONE	Issue Dt:		Application #:	16227364	Filing Dt:	12/20/2018
Publication #:	20190236038	Pub Dt:	08/01/2019
Inventors:	Swadesh Choudhary, Doddaballapur Jayashimha, Yen-Cheng Liu, Bahaa Fahim et al
Title:	BUFFERED INTERCONNECT FOR HIGHLY SCALABLE ON-DIE FABRIC

Assignment: 1

Reel/Frame:

048381/0052

Recorded: 02/20/2019

Pages: 11

Conveyance:

ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).

Assignors:

CHOUDHARY, SWADESH

Exec Dt:

02/20/2019

FAHIM, BAHAA

Exec Dt:

12/21/2018

JAYASIMHA, DODDABALLAPUR

Exec Dt:

01/22/2019

CHAMBERLAIN, JEFFREY

Exec Dt:

01/29/2019

LIU, YEN-CHENG

Exec Dt:

12/21/2018

Assignee:

INTEL CORPORATION

2200 MISSION COLLEGE BOULEVARD

SANTA CLARA, CALIFORNIA 95054

Correspondent:

ALAN BURNETT

4108 131ST AVE SE

BELLEVUE, 98006 UNITED STATES

Assignment: 2

Reel/Frame:

049222/0557

Recorded: 05/17/2019

Pages: 22

Conveyance:

CORRECTIVE ASSIGNMENT TO CORRECT THE THE WRONG APPLICATION NUMBER WAS ENTERED VIA EPAS (15227364 INSTEAD OF 16227364) PREVIOUSLY RECORDED ON REEL 048381 FRAME 0052. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT TO INTEL CORPORATION.

Assignors:

CHOUDHARY, SWADESH

Exec Dt:

02/20/2019