Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/21/2020
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Application #:
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16165763
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Filing Dt:
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10/19/2018
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Publication #:
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Pub Dt:
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08/01/2019
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Inventors:
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YOU-FA WANG, PU-HAN LIN, WEI-WEN LAI, YUAN-LUNG WU
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Title:
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PACKAGE STRUCTURE OF CAPACITIVE COUPLING ISOLATOR
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 22 SIN MING LANE #03-83 |
| MIDVIEW CITY, SINGAPORE 573969 |
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| LI&CAI INTELLECTUAL PROPERTY(USA) OFFICE |
| 3057 NUTLEY STREET |
| SUITE 818 |
| FAIRFAX, VA 22031 |
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