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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
09/22/2020
Application #:
16264071
Filing Dt:
01/31/2019
Publication #:
Pub Dt:
08/08/2019
Inventors:
Wolfgang Lehnert, Gerhard Metzger-Brueckl, Guenther Ruhl, Rudolf Berger, Roland Rupp
Title:
Wafer Composite and Method for Producing a Semiconductor Component
Assignment: 1
Reel/Frame:
049254/0639Recorded: 05/22/2019Pages: 10
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
02/01/2019
Exec Dt:
02/01/2019
Exec Dt:
02/03/2019
Exec Dt:
02/01/2019
Exec Dt:
02/04/2019
Assignee:
AM CAMPEON 1-15
NEUBIBERG, GERMANY 85579
Correspondent:
MURPHY, BILAK & HOMILLER/INFINEON TECHNO
1255 CRESCENT GREEN
SUITE 200
CARY, NC 27518

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