Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
02/11/2020
|
Application #:
|
16113116
|
Filing Dt:
|
08/27/2018
|
|
Publication #:
|
|
Pub Dt:
|
08/22/2019
| | | | |
|
Inventors:
|
Chun-Chih Liang, Kuang-Mao Lu, Hao-Yu Yang, Han-Chang Pan, Chih-Ming Ho, Ding-Hwa Cherng et al
|
|
Title:
|
SEMICONDUCTOR PACKAGE STRUCTURE
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| NO. 6-8, ZHONGHUA RD., SHULIN DIST., |
| NEW TAIPEI CITY, TAIWAN 23860 |
|
|
|
|
| YING CHEN CHEN YOSHIMURA LLP |
| 108 W 2ND STREET |
| #514 |
| LOS ANGELES, CA 90012 |
|
|
Search Results as of:
05/13/2024 06:53 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
