Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/02/2021
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Application #:
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16307926
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Filing Dt:
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12/07/2018
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Publication #:
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Pub Dt:
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08/29/2019
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Inventors:
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Mingzhu WANG, Bojie ZHAO, Takehiko TANAKA, Zhen HUANG
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Title:
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Molded Circuit Board of Camera Module, Manufacturing Equipment and Manufacturing Method for Molded Circuit Board
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 66-68, SHUNYU ROAD, YUYAO, |
| NINGBO, ZHEJIANG, CHINA 315400 |
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| DAVID AND RAYMOND PATENT FIRM |
| 108 N. YNEZ AVE., SUITE 128 |
| MONTEREY PARK, CA 91754 |
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